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Test
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ChampiAn
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ChampiSim
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ChampiAn
Analysis Overview |
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As
customized analysis to wafer types, ChampiAn
provides oxide modeling module (including Planarization Length calculation)
for oxide wafers, Total Metal Loss calculation for metal CMP and
blanket wafer analysis.
Besides, as general analysis, predefined graphs and data tables
cover hundreds of geneally used anlaysis. User may also create any
graphs from user's own definition with graph wizard.
Analysis by wafer type
General
analysis
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Oxide
modeling - Oxide CMP |
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For
oxide patterned wafers, ChampiAn
supports the CMP model developed at MIT. User will get Planarization
Lengths(PL) and Blanket Removal Rates on die level
as calculation results. Calculaltion results also include calculated
TIR, post-polish thickness prediction and effective densities
of given sites.
Once all necessary data - Pre-Polish Thickness, Post-Polish Thickness,
and Pre-Polish StepHeight - have been loaded, user can start PL
calculation.
What is Planarization Length? (PDF)
ChampiAn screen shots
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Total
Metal Loss - Metal CMP |
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Total
Metal Loss is the true measure of metal CMP processes, making up
for the insufficiency of using dishing and erosion values alone.
Total Metal Loss combines erosion and dishing values from profiles
and field oxide loss from thickness data.
With
ChampiAn's
Total Metal Loss analysis, user gets automatically calculated results
and can apply various options for calculation on the fly.
What is Total Metal Loss?
ChampiAn Screen shots
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Blanket
Wafer Analysis |
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ChampiAn
reads wafer data from KLA-Tencor
F5 and CDE Resmap.
Measured data also can be loaded through either user edited spread
sheet file or manual input.
Wafer
surface information is derived by interpolation based on loaded
data. Graphs for individual wafer's surface are Line
scan, Contour map
and 3D surface.
Like patterned wafer analysis, 2D graphs are also providing comparisons
between processes, polish times and wafers.
ChampiAn
screen shots
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Predefined
Graphs / Data Table |
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Graph
Data
All loaded measurement data and calculated CMP metrics can be drawn
as graphs or data tables.
Calculated data include Amount Removed, Removal Rate, TIR, Planarization
Efficiency(%), Within Die Non-Uniformity and results of oxide modeling.
Statistics on dies, sites and wafers are also available.
Graph type
Supported graphs are line graphs, 3D die surface and
contour plots.
Line Graph has 1 or 2 Y axes and provides easy ways to compare
and observe data trends. It can be converted to data table.
3D
surface graph shows die surface for patterned wafer and wafer surface
for blanket wafer. User can change view points using horizontal
and vertical sliders.
Contour plot is either line type or color area type, displaying
surface information.
ChampiAn screen shots
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User
Defined Graphs (FlexiGraph) |
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In
addition to hundreds of predefined plots available, user-defined data
sets and graphs can be created by using the FlexiGraph module. This
graph wizard is entirely mouse driven, easy to learn but provides
extreme flexibility.
With
FlexiGraph, user can
- define new data set using basic mathematical formula on existing
data sets
- define new graphs
- filter data by giving conditions. With this feature, any abnormal
data points can be excluded from results
- use statistic values
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SKW
Associates, Inc.
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