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Products
& Services
Test
Wafers
Analysis
Software
>
ChampiAn
>
ChampiSim
Metrology
Service
Defect
Characterization
&
E-Testing
Services
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ChampiAn
-
Analysis
Patterned Oxide Modeling |
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For
oxide pattern wafers, ChampiAn
supports the CMP model developed at MIT.
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Trigger
calculation |
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Once
all necessary data - Pre-Polish Thickness, Post-Polish Thickness,
and Pre-Polish StepHeight - have been loaded, user can start PL calculation.
To select wafers to calculate PL and click a button is all to do. |
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Results
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Model
Parameters (Planarization Length, Blanket Removal Rate) and
TIR are calculated. Calculated TIR is a TIR based on modeling results,
not measured data. |
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Finding
Planarization Length is the process to fit predicted data to measured
one. User may check fitting error in result graphs. Following graph
is comparing Measured data to Predicted data for die 4 of wafer 1. |
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