|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
ChampiAn
Module Description |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
ChampiAn
is designed to help engineers develope CMP processes using patterned
wafers.
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Workflow |
|
 |
|
|
|
|
|
|
|
|
|
|
See
• Experiment Design
• Sample Plans
•
Automatic Data Loading
•
Analysis
•
Scan Analyzer
• Other Benefits
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
module
list |
|
Experiment
Design |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
•
Design experiments with many factors
- factors can be any parameter or objects such as slurries, down forces,
speeds etc.
• Organized to compare processes effectively |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Sample
Plans |
module
list |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
 |
|
|
|
|
|
|
|
|
|
Pre-defined
Sample Plans:
All SKW standard measurement plans on SKW wafers are provided with
installation. |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
 |
|
|
|
|
|
|
|
|
Customizing
:
User can define any sample plan by specifying
Wafer size, wafer type, die size, die locations and
site information to measure.
Sample plans are easily imported/exported among users. |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Automatic
Data Loading |
module
list |
|
|
ChampiAn's
automatic loader covers major metrology tools.
• Thickness data
- KLA Tencor Uv1050, F Series
- Therma-Wave
Opti-Probe
- Nanometrics NanoSpec/AFT
• Profile Data
- KLA Tencor P series, HRP
- Veeco
- PSIA XEP Series
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Analysis |
module
list |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
 |
|
ChampiAn
provides both custormized anaysis for specific wafer type and general
graphs that are common to all wafer types. It helps user to evaluate
processes through various types of results. |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
•
Automatic calculation of critical CMP metrics
such as
- Removal rates
- Within-die and within-wafer non-uniformities
- Oxide modeling : Planarization length based on patterned wafer
data using MIT Model
- Oxide modeling :Thickness prediction using Planarization Length
- Metal CMP : Total Metal Loss
• Comparisons
between sites, densities, dies, wafers, polish times and experimental
factors
• Statistics
Min, Max, Average, Standard Deviation, Ranges
• FLEX Graph
Graph wizard guides user to define and create new data sets and
graphs not included in the software.
go to full description of Analysis
module
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Other
Benefits |
module
list |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
•
Permanently stores all input data and calculated metrics
• Sharing of all experimental data, Layout data and Sample
plans among engineers
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
